- Material: Copper (CU) with 99.98% purity
- Substrate Thickness: Ranges from 0.018mm to 0.10mm
- Adhesive Thickness: Varies between 0.035mm to 0.04mm
- Adhesive Types:
- Ordinary Pressure-Sensitive Adhesive (Non-Conductive)
- Conductive Acrylic Pressure-Sensitive Adhesive
- Peeling Force: 1.0 to 1.5 kg/25mm (Based on 180-degree reverse peeling force test)
- Temperature Resistance: Operates within a range of -10°C to 120°C
- Tensile Strength: 4.5 to 4.8 kg/mm
- Elongation: Minimum elongation of 7% to 10%
